Clean room

Our clean room offers state-of-the art devices for the whole spectrum of microsystem technology procedures:

Design and simulation

• Simulators: Finite element model/FEM with COMSOL and mathematical studies with MathLab
• Layout tools: CAD/CleWin or ProEngineer

Substrate preparation/cleaning

• Plasma systems: 0₂ ,CF₄
• Polishing machine for chemical-mechanical polishing procedures/CMP
• Chemical cleaning baths: Si, glass, optical materials

Structuring

• Photolithography: 365nm exposure in proximity and vacuum contact, back exposure, DUV-flood exposure, Spin-/ Gyrset-Coater, Puddle developing
• Nanoimprint-Lithography / NIL
• Selective wet chemical etching technique
• Dry etching processes: Reactive Ion Etching / RIE, Kryo Inductively Coupled Plasma / ICP

Coating/Diffusion

• Sputter systems: co-sputter systems, substrate heating up to 400°C
• Evaporation systems: electron-beam evaporator and thermal evaporator
• Material-/ inkjet printing
• Electroplating for thermoelectric materials and metals
• Diffusion-oxidation plants: dry and wet oxidation, temperature up to 1100°C
• Plasma-enhanced chemical vapor deposition / PECVD
• Rapid thermal annealing / RTA
• Molecular beam epitaxy / MBE
• Pulsed laser deposition / PLD

Mounting and assembling technology

• Precision saw/ wafer saw
• Ball /wedge bonders
• Welding unit: Resistance-, Wolfram-Inertgas (WIG) and ultrasonic welding

Structure and materials analysis

• Ellipsometry
• Profilometry
• Scanning electron microscope/ SEM with energy dispersive X-ray spectroscopy / EDX and electron backscatter diffraction / EBSD
• atomic force microscope / AFM
• Laser scanning microscope
• Measurement technology for the determination of thermoelectrical, optical and gas sensitive characteristics.