Electronic speckle interferometry for measurements accurate to the nanometer

Measuring micro deformations

During material processing by welding or cutting, irreversible strains can be introduced into the surrounding material. They reduce the value of the component considerably since they lead to expensive reworking.

A micro-deformation measurement system from Fraunhofer IPM detects minimal changes to the component topography very quickly, two-dimensionally and down to the nanometer range.This allows very slight changes or deformation of the component surface – e.g. when subjected to mechanical or thermal loads – to be measured precisely, even at high production speeds.  The system operates on the basis of the principle of electronic speckle interferometry (ESPI). The great advantage of this measurement technique is its accuracy.