Clean room services

We model, coat and structure your materials in our 400m² clean room of class 100 and 1000. From development through to prototype production, we will be delighted to help you.

• Design and simulation
• Substrate preparation/cleaning
  
  
• Structuring
  
  • Photolithography
  • Nanoimprint method
  • Selective wet chemical etching technique
  • Dry etching processes (reactive ion etching/RIE and inductively coupled plasma etching/ICP)
     
• Coating/diffusion (incl. precious metals, semiconductors and oxides):
  • Deposition systems
  • Inkjet printing
  • Electroplating
  • Diffusion-oxidation plants (dry and wet)
  • Plasma-enhanced chemical vapor deposition / PECVD
  • Rapid thermal annealing / RTA
     
• Construction and bonding technology
  • Ball/wedge bonders
  • Gap welding apparatus
     
• Structural analysis
  • Ellipsometry
  • Profilometry
  • Scanning electron microscopy/SEM
  • Atomic force microscopy/AFM
  • Laser scanning microscopy

With these tailor-made technologies, we offer you the opportunity to implement your ideas in thin-layer and thick-layer technology. Your substrates may be circular or rectangular, with sizes ranging from less than one inch to six inches, and may even consist of different materials.

• Diverse substrates – circular and rectangular, from fragments to 6 inches
  • flexible foils (polyimide, polyester, etc.)
  • ceramic (Al₂O₃, AlN, etc.)
  • glass (SiO₂, BK7, etc.)
  • Si substrates
  • special optical materials (LiNbO₃, BaF₂, sapphire, etc.)