We model, coat and structure your materials in our 400m² clean room of class 100 and 1000. From development through to prototype production, we will be delighted to help you.
- Design and simulation
- Substrate preparation/cleaning
- Structuring
- Photolithography
- Nanoimprint method
- Selective wet chemical etching technique
- Dry etching processes (reactive ion etching/RIE and inductively coupled plasma etching/ICP)
- Coating/diffusion (incl. precious metals, semiconductors and oxides):
- Deposition systems
- Inkjet printing
- Electroplating
- Diffusion-oxidation plants (dry and wet)
- Plasma-enhanced chemical vapor deposition / PECVD
- Rapid thermal annealing / RTA
- Construction and bonding technology
- Ball/wedge bonders
- Gap welding apparatus
- Structural analysis
- Ellipsometry
- Profilometry
- Scanning electron microscopy/SEM
- Atomic force microscopy/AFM
- Laser scanning microscopy
With these tailor-made technologies, we offer you the opportunity to implement your ideas in thin-layer and thick-layer technology. Your substrates may be circular or rectangular, with sizes ranging from less than one inch to six inches, and may even consist of different materials.
- Diverse substrates – circular and rectangular, from fragments to 6 inches
- flexible foils (polyimide, polyester, etc.)
- ceramic (Al2O3, AlN, etc.)
- glass (SiO2, BK7, etc.)
- Si substrates
- special optical materials (LiNbO3, BaF2, sapphire, etc.)