© Fraunhofer IPM

Thin-layer and thick-layer technology from nm to µm#

Clean room services

We model, coat and structure your materials in our 400m² clean room of class 100 and 1000. From development through to prototype production, we will be delighted to help you.

  • Design and simulation
  • Substrate preparation/cleaning

  • Structuring
    • Photolithography
    • Nanoimprint method
    • Selective wet chemical etching technique
    • Dry etching processes (reactive ion etching/RIE and inductively coupled plasma etching/ICP)
  • Coating/diffusion (incl. precious metals, semiconductors and oxides):
    • Deposition systems
    • Inkjet printing
    • Electroplating
    • Diffusion-oxidation plants (dry and wet)
    • Plasma-enhanced chemical vapor deposition / PECVD
    • Rapid thermal annealing / RTA
  • Construction and bonding technology
    • Ball/wedge bonders
    • Gap welding apparatus
  • Structural analysis
    • Ellipsometry
    • Profilometry
    • Scanning electron microscopy/SEM
    • Atomic force microscopy/AFM
    • Laser scanning microscopy

With these tailor-made technologies, we offer you the opportunity to implement your ideas in thin-layer and thick-layer technology. Your substrates may be circular or rectangular, with sizes ranging from less than one inch to six inches, and may even consist of different materials.

  • Diverse substrates – circular and rectangular, from fragments to 6 inches
    • flexible foils (polyimide, polyester, etc.)
    • ceramic (Al2O3, AlN, etc.)
    • glass (SiO2, BK7, etc.)
    • Si substrates
    • special optical materials (LiNbO3, BaF2, sapphire, etc.)