HoloTop Motion

The digital holographic sensors in the HoloTop Motion series capture the 3D surface of moving components with micrometer accuracy during production. Depending on the objective, the sensors can achieve a lateral resolution of less than two micrometers. Often, they are the only solution for precise, full-surface 3D measurements while still maintaining high throughput. Thus, they enable reliable quality control in the production of wafers, microbump arrays, metal surfaces, and gear components.

3D surface measurement without stopping production

In many production processes, components must be temporarily stopped or even completely diverted from the production line for precise 3D inspection. This results in the loss of valuable cycle time and makes it difficult to perform comprehensive quality control on large surfaces or continuously moving components. HoloTop Motion sensors measure surfaces in motion, providing the foundation for 3D surface testing without interrupting production.

The digital holographic sensors illuminate a narrow section of the surface and capture its topography across the entire area with a high point density. The surface is scanned section by section in the direction of travel. The acquired 3D measurement data is then stitched together to produce a continuous surface topography.

Thus, HoloTop Motion sensors can capture virtually any length of surface in three dimensions. The only limitations are those resulting from specific system integration. The width of the measurement section depends on the required lateral resolution and can be individually adjusted by selecting the appropriate lens.

Measuring macroscopic surfaces with microscopic resolution

HoloTop Motion sensors use digital multi-wavelength holography. They capture the entire light wave that is backscattered from a surface, including the light’s intensity and the phase.

The three-dimensional surface geometry of the component is calculated from the recorded interference pattern in a fraction of a second. What sets the HoloTop Motion sensors apart is their ability to calculate this 3D data from a single image. Thus, they provide submicrometer-accurate height data even for objects moving at speeds of up to 1 m/s.

Custom-designed for high-speed production processes

HoloTop Motion sensors are ideal for high-throughput production processes, such as those in electronics manufacturing and the metalworking industry. The sensors can be used to measure wafers, interposers, microbump arrays, as well as precision-machined metal surfaces, gears, transmission components, and engine and aerospace components. They reliably and quickly capture large or continuously moving surfaces in 3D with high precision, eliminating the need to stop the conveyor belt or separate the components.

We customize each HoloTop Motion sensor to meet customer requirements and integrates it into the production environment. The laser wavelength, lens, and software are adapted to the specific measurement task at hand. Depending on the desired resolution, the lens can be easily replaced without altering the sensor design. Sensor integration into the production line is carried out in close collaboration with the application partner.