The cooling and temperature control of components and systems is playing an increasingly important role, particularly in the field of electronics. We offer solutions for thermal management based on heat pipes and Peltier coolers.
Heat pipes are highly effective at transferring heat, making them particularly suitable for hot-spot cooling in electronics. We can develop and characterize heat pipes of various designs according to individual requirements.
For future applications, e.g. in electromobility, thermal switches need to become more efficient and cost-effective. We are researching new concepts for heat switches based on heat pipes.
We develop, build and characterize Peltier-based temperature control systems for specific applications. In addition, on our semi-automated module construction line, we manufacture customized Peltier modules in small series.
Thermal simulations help us understand the behavior of functional materials under specific conditions. This enables us to integrate the materials optimally into components and systems.
How do functional materials behave during heat and mass transfer in two-phase fluids? Thermodynamic simulations help us to understand such processes and optimize our system concepts.
Fraunhofer Institute for Physical Measurement Techniques IPM