HILaM research project / 2024
Controlled laser drilling of microvias
In the production of printed circuit boards (PCBs), micrometer-diameter vias – known as microvias – are drilled through multilayer PCBs. Lasers can drill through these structures with high throughput and micrometer precision. A measurement technique based on laser-induced breakdown spectroscopy (LIBS) is set to check the quality of the holes inline and control the process.
more info