Equipment | Procedures

Design and simulation

• Simulators: Finite element model (FEM) with COMSOL and mathematical studies with MathLab
• Layout tools: CAD / CleWin or ProEngineer

Substrate preparation / Substrate cleaning

• Plasma systems: O₂ , CF₄
• Polishing machine for chemical-mechanical polishing procedures (CMP)
• Chemical cleaning baths: Si, glass, optical materials

Structuring

• Photolithography: 365 nm exposure in proximity and vacuum contact, back exposure, DUV-flood exposure, Spin-/ Gyrset-Coater, Puddle developing
• Nanoimprint-Lithography (NIL)
• Selective wet chemical etching technique
• Dry etching processes: Reactive Ion Etching (RIE) , Kryo Inductively Coupled Plasma (ICP)

Materials synthesis

• Melt synthesis
• Powder production and processing

Coating / Diffusion

• Sputter systems: co-sputter systems, substrate heating up to 400°C
• Evaporation systems: electron-beam evaporator and thermal evaporator
• Material-/ inkjet printing
• Electroplating
  
• Diffusion and oxidation plants: dry and wet oxidation, temperature up to 1200°C
• Pulsed laser deposition (PLD)

Mounting and assembling technology

• Precision saw / wafer saw
• Ball / wedge bonders
• Welding unit: Resistance-, Wolfram-Inertgas (WIG) and ultrasonic welding

Structure and materials analysis

• Ellipsometry
• Profilometry
• Scanning electron microscope (SEM) with energy dispersive X-ray spectroscopy (EDX) and electron backscatter diffraction (EBSD)
• Computed Tomography (CT) with micro- and nanofocus
  
• Laser scanning microscope
• Measurement technology for the determination of thermoelectrical, optical and gas sensitive characteristics