Equipment | Procedures

Design and simulation

  • Simulators: Finite element model (FEM) with COMSOL and mathematical studies with MathLab
  • Layout tools: CAD / CleWin or ProEngineer

Substrate preparation / Substrate cleaning

  • Plasma systems: O2 , CF4
  • Polishing machine for chemical-mechanical polishing procedures (CMP)
  • Chemical cleaning baths: Si, glass, optical materials


  • Photolithography: 365 nm exposure in proximity and vacuum contact, back exposure, DUV-flood exposure, Spin-/ Gyrset-Coater, Puddle developing
  • Nanoimprint-Lithography (NIL)
  • Selective wet chemical etching technique
  • Dry etching processes: Reactive Ion Etching (RIE) , Kryo Inductively Coupled Plasma (ICP)

Materials synthesis

  • Melt synthesis
  • Powder production and processing

Coating / Diffusion

  • Sputter systems: co-sputter systems, substrate heating up to 400°C
  • Evaporation systems: electron-beam evaporator and thermal evaporator
  • Material-/ inkjet printing
  • Electroplating
  • Diffusion and oxidation plants: dry and wet oxidation, temperature up to 1200°C
  • Pulsed laser deposition (PLD)

Mounting and assembling technology

  • Precision saw / wafer saw
  • Ball / wedge bonders
  • Welding unit: Resistance-, Wolfram-Inertgas (WIG) and ultrasonic welding

Structure and materials analysis

  • Ellipsometry
  • Profilometry
  • Scanning electron microscope (SEM) with energy dispersive X-ray spectroscopy (EDX) and electron backscatter diffraction (EBSD)
  • Computed Tomography (CT) with micro- and nanofocus
  • Laser scanning microscope
  • Measurement technology for the determination of thermoelectrical, optical and gas sensitive characteristics