Clean room

Our clean room offers state-of-the art devices for the whole spectrum of microsystem technology procedures:

Design and simulation

  • Simulators: Finite element model/FEM with COMSOL and mathematical studies with MathLab
  • Layout tools: CAD/CleWin or ProEngineer

Substrate preparation/cleaning

  • Plasma systems: 02 ,CF4
  • Polishing machine for chemical-mechanical polishing procedures/CMP
  • Chemical cleaning baths: Si, glass, optical materials


  • Photolithography: 365nm exposure in proximity and vacuum contact, back exposure, DUV-flood exposure, Spin-/ Gyrset-Coater, Puddle developing
  • Nanoimprint-Lithography / NIL
  • Selective wet chemical etching technique
  • Dry etching processes: Reactive Ion Etching / RIE, Kryo Inductively Coupled Plasma / ICP


  • Sputter systems: co-sputter systems, substrate heating up to 400°C
  • Evaporation systems: electron-beam evaporator and thermal evaporator
  • Material-/ inkjet printing
  • Electroplating for thermoelectric materials and metals
  • Diffusion-oxidation plants: dry and wet oxidation, temperature up to 1100°C
  • Plasma-enhanced chemical vapor deposition / PECVD
  • Rapid thermal annealing / RTA
  • Molecular beam epitaxy / MBE
  • Pulsed laser deposition / PLD

Mounting and assembling technology

  • Precision saw/ wafer saw
  • Ball /wedge bonders
  • Welding unit: Resistance-, Wolfram-Inertgas (WIG) and ultrasonic welding

Structure and materials analysis

  • Ellipsometry
  • Profilometry
  • Scanning electron microscope/ SEM with energy dispersive X-ray spectroscopy / EDX and electron backscatter diffraction / EBSD
  • atomic force microscope / AFM
  • Laser scanning microscope
  • Measurement technology for the determination of thermoelectrical, optical and gas sensitive characteristics.